top - download
⟦63b6297c5⟧ Wang Wps File
Length: 3378 (0xd32)
Types: Wang Wps File
Notes: Spelunked
Names: »~ORPHAN70.08«
Derivation
└─⟦459bdb0e5⟧ Bits:30006057 8" Wang WCS floppy, CR 0089A
└─ ⟦this⟧ »~ORPHAN70.08«
WangText
]…00……00……00……00…F…0a……00……00…F…0b…F
9…0a…9…0f……1e……0b……1e……0c……1e……0d……1e……0e……1e……01……1e… …1e……05……1d……0a……1d……0d……1d…
…1c……08……1c……0c……1c……05……1b……0a……1b……0b……1b……0d……1b……0e……1b……0f……1b……02……1b……07……1a……0b……1a……0d……1a… …1a……06……1a……07……19……0c……19……02……19…
…19… …18……08……18……09……18……0d……18……00……18……06……17……0c……17……0d……17……0e……17……0f……17… …16……0b……16……0f……16……00……16……07……15……0e……15……02……15……07……14……86…1 …02… …02… …02…
…02…CPS/SDS/001
…02…SRA/820402…02……02…
CAMPS SYSTEM DESIGN SPECIFICATION
…02…ISSUE 1.2…02…CAMPS
T̲A̲B̲L̲E̲ ̲O̲F̲ ̲C̲O̲N̲T̲E̲N̲T̲S̲
5 SUBSYSTEM SPECIFICATION ......................
3
5.1 CR80D SYSTEM DESIGN .....................
3
5.1.1 Scope ................................
3
5.1.2 CR80D Crate Assy. ....................
3
5.1.3 CR80D Buses ..........................
8
5.1.3.1 CR80D Main Buses (DMB) ...........
8
5.1.3..1 Functional Description of the
CR80D Main Bus (DMB) .........
11
5.1.3.1.2 Electrical Description of the
CR80D Main Bus ...............
22
5.1.3.2 The CR80D Data Channel (DDC)......
26
5.1.3.2.1 Funcional Description of the
DDC ..........................
26
5.1.4 Processor Sub-System (PRS) ...........
33
5.1.4.1 Design & Construction ............
35
5.1.4.1.1 Functional Description of the
CR80D Contol Bus (DCB) ......
35
5.1.4.1.2 Electrical Description of the
DCB ..........................
42
5.1.4.1.3 Central Processing Unit and
CACHE Memory (CPU/CACHE) .....
43
5.1.4.1.3.1 The CPU .................
43
5.1.4.1.3.2 The CACHE Memory CTRL ....
47
5.1.4.1.3.3 Mechanical & Electrical
Specifications ...........
53
5.1.4.1.4 The MAP and Map Interface Adapter
(MIA) ........................
54 5.1.4.1.4.1
The
MAP
Module
...........
56
5.1.4.1.4.2 The MIA Module ...........
75
5.1.4.1.4.3 Mechanical & Electrical
Specifications ...........
89
5.1.4.1.5 Intentionally Left Blank .....
93
.1.4.1.6 The RAM Module ...............
94
5.1.4.1.6.1 Mechanical & Electrical
Specifications ...........
97
5.1.4.1.7 The STI/TIA Modules ..........
98
5.1.4.1.7.1 The TIA ..................
100
5.1.4.1.7.2 The STI ..................
104
5.1.4.1.7.3 Mechanial & Electrical
Specifications ...........
109
5.1.4.1.8 The CCA Module ...............
110
5.1.4.1.9 The Power Supply .............
110
5.1.4.2 Documentation ....................
110
5.1.4.3 Environment ..................... 110
5.1.5 I/O Sub-System .......................
111
5.1.5.1 Design & Construction ............
113
5.1.5.1.1 The CIA Module ...............
114
5.1.5.1.1.1 Mechanical & Electrical
Specifictions ........... 121
5.1.5.1.2 The Disk CTRL & DCA ..........
122
5.1.5.1.2.1 The Disk CTRL ............
122
5.1.5.1.2.2 The DCA ..................
135
5.1.5.1.2.3 Mechanical & Electrical
Specification ........... 138
5.1.5.1.3 The LTU & Adapter ............
141
5.1.5.1.3.1 The LTU ..................
141
5.1.5.1.3.2 The LIA-N ................
149
5.1.5.1.3.3 Mechanical & Electrical
Specification .....