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WangText
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SEISMIC
DATA PREPROCESSING
SYSTEM…02…1982-07-30…02……02…
SECTION
II
MANAGEMENT
PROPOSAL…02……02…
5 PROJECT IMPLEMENTAION PLAN ....................
5.1 Phase I: Specification .....................
5.1.1 WP 110: Phase I Management .............
5.1.2 WP 120: Requirements Definition ........
5.1.3 WP 130: System Design Spec. (SDS) .....
5.1.4 WP 140: Hardware Specification .........
5.1.5 WP 150: Software Specification .........
5.1.6 WP 160: Test Requirement Spec. .........
5.1.7 WP 170: Documentation Requirement Spec..
5.2 Phase II: Implmentation of Raw Data
Recording System .................
5.2.1 WP 210: Phase II Management ............
5.2.2 WP 220: System Engineering .............
5.2.3 WP 230: Module Implementation ..........
5.2.3. WP 231: System Management ..........
5.2.3.2 WP 232: Mechanical and Electrical
Design .....................
5.2.3.3 WP 233: Seismic Data Interface .....
5.2.3.4 WP 234: SEG-D Formatter Software ...
52.3.5 WP 235: 6250 PBI Tape ..............
5.2.3.6 WP 236: Data Channel ...............
5.2.3.7 WP 237: Test Software ..............
5.2.4 WP 240: Procurement ....................
5.2.5 WP 250: System Integration ............
5.2.6 WP 260: Delivery .......................
5.2.7 WP 270: Acceptance Test ................
5.3 Phase III: Implementation of Preprocessing .
System ..........................
5.3.1 WP 31: Phase III Management ...........
5.3.2 WP 320: System Engineering .............
5.3.3 WP 330: Module Implementation ..........
5.3.3.1 WP 331: SDI/MTC mfg. Documentation .
5.3.3.2 WP 322: Floating Point Processor...
5.3.3.3 WP 333: Spatial Resampling .........
5.3.3.4 WP 334: Time Resampling ............
5.3.3.5 WP 335: SEG-D Formatter ............
5.3.3.6 WP 336: 1 MW RAM ...................
5.3.3.7 WP 337: Tes Software ..............
5.3.4 WP 340: Procurement ....................
5.3.5 WP 350: System Integration .............
5.3.6 WP 360: Delivery .......................
5.3.7 WP 370: Acceptance Test ................
5.3.8 WP 380: Documentation ..................
5.3.9 WP 390: Training .......................
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5̲ ̲ ̲P̲R̲O̲J̲E̲C̲T̲ ̲I̲M̲P̲L̲E̲M̲E̲N̲T̲A̲T̲I̲O̲N̲ ̲P̲L̲A̲N̲
This section describes the proposed implementation
plan for the Seismic Data Preprocessing System. See
figure 5-1 overleaf.
The work is divided nto three phases.
Phase I: System specification,
Hardware specification and
Software specification
Phase II: Design, development, procurement,
integration and delivery of a subset of the
phase III delivery, capable of recording n
Raw Data mode
Phase III: Design, development, procurement,
integration and delivery of upgrades to the
phase II delivery to provide the full SDPS
processing system.
As working-assumptions for this proposal, we have presumed
th following:
a) The phase II delivery is returned TBD months after
the delivery for upgrading to the full SDPS System.
b) The customer furnishes a simulator which provides
an interface equivalent to the "NESSIE", and sufficient
types of test dat for development and, in particular,
for the Acceptance testing.
We want to emphasize that we are prepared to discuss
alternatives to these working assumptions, or to other
explicit or implicit presumptions.
5.1 P̲h̲a̲s̲e̲ ̲I̲:̲ ̲S̲p̲e̲c̲i̲f̲i̲c̲a̲t̲i̲o̲n̲
Phase consists of a detailed requirement analysis
and specification of the system to be provided in phase
II and phase III. This is made in close cooperation
between the customer and the contractor.
The output from phase I is a mutually agreed upon tehnical
specification for the SDPS, and a planning for phase
II.
5.1.1 W̲P̲ ̲1̲1̲0̲:̲ ̲P̲h̲a̲s̲e̲ ̲I̲ ̲m̲a̲n̲a̲g̲e̲m̲e̲n̲t̲
The activities are
a) Project management
o Interface and communication with GECO
o Coordination of activities
o Schedule control
o Acton item control
b) Documentation, reporting
o Progress reports (monthly)
o Arrange for meetings and reviews
o Prepare schedules, agendas and minutes
c) Phase II Planning
Output: Progress reports
Phase II Project Implementation Plan
5.1.2 W̲P̲ ̲1̲2̲0̲:̲ ̲R̲e̲q̲u̲i̲r̲e̲m̲e̲n̲t̲s̲ ̲D̲e̲f̲i̲n̲i̲t̲i̲o̲n̲
Purpose: Definition of requirements in view of the
proposed system design.
Activities: Detailed review of the requirements in
close cooperation with the customer and
with the technical solution in view.
Output: SDPS Requirements Specification
5.1.3 W̲P̲ ̲1̲3̲0̲:̲ ̲S̲y̲s̲t̲e̲m̲ ̲D̲e̲s̲i̲g̲n̲ ̲S̲p̲e̲c̲i̲f̲i̲c̲a̲t̲i̲o̲n̲ ̲(̲S̲D̲S̲)̲
Purpose: The SDS shall provide the basis for a systems
design which implements the required qualities.
Activities: A system desin specification is made based
on the agreed requirements specification.
The specification will, for example, consist
of:
o system architecture, SW & HW
o specification of major nterfaces, SW & HW
o system performance
o system operation
Output: System Design Specification
5.1.4 W̲P̲ ̲1̲4̲0̲:̲ ̲H̲a̲r̲d̲w̲a̲r̲e̲ ̲S̲p̲e̲c̲i̲f̲i̲c̲a̲t̲i̲o̲n̲ ̲
Purpose: To assure a coherent hardware design with
the required performance
Activities: Specification of all hardware items to
module leve
Output: SDPS Hardware Specification
5.1.5 W̲P̲ ̲1̲5̲0̲:̲ ̲S̲o̲f̲t̲w̲a̲r̲e̲ ̲S̲p̲e̲c̲i̲f̲i̲c̲a̲t̲i̲o̲n̲
Purpose: To assure a coherent software design with
the requires performance
Activities: Specification of all software to module
level
Output: SDPS Software Speciication
5.1.6 W̲P̲ ̲1̲6̲0̲:̲ ̲T̲e̲s̲t̲ ̲R̲e̲q̲u̲i̲r̲e̲m̲e̲n̲t̲ ̲S̲p̲e̲c̲.̲
Activities: Definition of test requirements in cooperation
with customer
Output: SDPS Test Requirement Specification
5.1.7 W̲P̲ ̲1̲7̲0̲:̲ ̲D̲o̲c̲u̲m̲e̲n̲t̲a̲t̲i̲o̲n̲ ̲R̲e̲q̲u̲i̲r̲e̲m̲e̲n̲t̲ ̲S̲p̲e̲c̲i̲f̲i̲c̲a̲t̲i̲o̲n̲
Activities: Definiton of requirements to documentation
in cooperation with customer
Output: SDPS Documentation Requirement Specification
5.2 P̲h̲a̲s̲e̲ ̲I̲I̲:̲ ̲I̲m̲p̲l̲e̲m̲e̲n̲t̲a̲t̲i̲o̲n̲ ̲o̲f̲ ̲R̲a̲w̲ ̲D̲a̲t̲a̲ ̲R̲e̲c̲o̲r̲d̲i̲n̲g̲ ̲S̲y̲s̲t̲e̲m̲
This preliminary phase II Project Implementation plan
is to be replaced by the one, provided from WP 110
during phase I.
The implementation phase starts after customer approval
of the specifications, and working meetings will be
held as needed.
Design review will be held at the following milestones
D.R.1: Phase II HW design complete
Phase II SW design complee
D.R.2: HW prototypes have been tested individually
SW modules have been tested individually
D.R.3: HW/SW integration on subsystem level complete
D.R.4: Phase II review
Installation of phase II and Acceptance test
successfully completd
See work breakdown on figure 5-2 overleaf
5.2.1 W̲P̲ ̲2̲1̲0̲:̲ ̲P̲h̲a̲s̲e̲ ̲I̲I̲ ̲M̲a̲n̲a̲g̲e̲m̲e̲n̲t̲
The activities are
a) Project management
o Interface and communication with GECO
o Coordination of activities
o Schedule control
o Action item control
b) Documentation, Reporting
o Progress reports (monthly)
o Arrange for meetings and reviews
o Prepare schedules, agendas and minutes
c) Phase III planning
Output: Progress Reports
Phase III Project Implementation Plan
5.2.2 W̲P̲ ̲2̲2̲0̲:̲ ̲S̲y̲s̲t̲e̲m̲ ̲E̲n̲g̲i̲n̲e̲e̲r̲i̲n̲g̲
The System engineering comprises
o Technical coordination
o Quality Assurance
o Test plans and procedures
W̲P̲ ̲2̲2̲1̲: Technical coordination
Purpose: To assure the implementation of a system which fulfils
the technical requirements
The activities are
o Technical coordination of all hardware
and software development and procurement
activities
o Participation in all internal andexternal
technical reviews
o Performance analysis
Output: Engineering notes
Test plans and procedures specification
W̲P̲ ̲2̲2̲2̲: Quality Assurance
Purpose: To assure that required levels of quality
are met
The activities are
o Qulity control on hardware design, manufacturing
and documentation
o Quality control on software design and
documentation
o Configuration and change control
o Reliability
Supervision, control, analysis, trade-offs,
testing
Output: Inspection and test procedures
Inspection and test report…86…1 …02…
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W̲P̲ ̲2̲2̲3̲:̲ Test plans and procedures
Purpose: Assuring Correct and reproducible tests,
according to the requirements.
Activities: Preparation of test plans and procedures
Outpt: Factory test plan
Factory test procedure
Acceptance test plan
Acceptance test procedure
5.2.3 W̲P̲ ̲2̲3̲0̲:̲ ̲M̲o̲d̲u̲l̲e̲ ̲I̲m̲p̲l̲e̲m̲e̲n̲t̲a̲t̲i̲o̲n̲
The work breakdown follows the modular approach of
the hardware and software.
This work package is a umber of sub-packages, each
covering essentially all effort for the detailed design,
development, manufacturing/coding and testing of all
hard, firm and software required for the particular
module.
5.2.3.1 W̲P̲ ̲2̲3̲1̲:̲ ̲S̲y̲s̲t̲e̲m̲ ̲M̲a̲n̲a̲g̲e̲m̲e̲n̲t̲
The system anagement software is designed, developed,
coded and tested according to the detailed design specification,
provided in WP 222.2.
The following modules are designed, developed, coded
and tested:
WP 231.1: Man-Machine Interface
WP 231.2: Messae Interpreter
WP 231.3: Device Control and Monitor
WP 231.4: Error Status Interpreter
WO 232.5: Logging
5.2.3.2 W̲P̲ ̲2̲3̲2̲:̲ ̲M̲e̲c̲h̲a̲n̲i̲c̲a̲l̲ ̲a̲n̲d̲ ̲e̲l̲e̲c̲t̲r̲i̲c̲a̲l̲ ̲d̲e̲s̲i̲g̲n̲
This work package covers efforts related to the housing
and interconnection of crates.
The following activities are included:
WP 232.1: Mechanical design at rack-level and front
panel layout.
WP 232.2: Electrical design, PU crate
WP 232.3: Electrical design, S-I/O crate
WP 232.4: Specification of cables
5.2.3.3 W̲P̲ ̲2̲3̲3̲:̲ ̲S̲e̲i̲s̲m̲i̲c̲ ̲D̲a̲t̲a̲ ̲I̲n̲t̲e̲r̲f̲a̲c̲e̲
The SDI hardwar, firmware and software is implemented
according to the corresponding specifications, provided
in phase I.
This work package covers the following activities:
WP 233.1: Detailed SDI and Adapter hardware design,
development, manufacturing and preiminary
test.
This module will be delivered in a wire-wrap
version.
WP 233.2: Detailed firmware design development and
coding
WP 233.3: HW/FW integration and test
WP 233.4: SDI handler detailed design, development,
coding and test
WP 23.5: HW/FW/SW integration
WP 233.6: Maintenance & Diagnostic (M&D) Software
design, development, coding and test
WP 233.7 Built-In-Test design, development, coding
and test.
5.2.3.4 W̲P̲ ̲2̲3̲4̲:̲ ̲S̲E̲G̲-̲D̲ ̲F̲o̲r̲m̲a̲t̲t̲e̲r̲ ̲S̲o̲f̲t̲w̲a̲r̲e̲
The MUX SEG-D software required for the Raw Data recording
is designed, developed, coded and tested.
5.2.3.5 W̲P̲ ̲2̲3̲5̲:̲ ̲6̲2̲5̲0̲ ̲B̲P̲I̲ ̲T̲a̲p̲e̲
Te firmware and software is implemented according to
the corresponding specification provided in phase I.
The design of the controller hardware is made under
WP 233.1.
The following activities are covered:
WP 235.1: Adapter design and developmen. Controller
and Adapter hardware manufacturing and
preliminary test.
This module will be delivered in a wire-wrap
version.
WP 235.2: Detailed firmware development and coding
WP 235.3: HW/FW integration and test
WP 235.4: Handler, detaild design, development, coding
and test
WP 235.5: HW/FW/SW integration
WP 235.6: Maintenance and diagnostic (M & D)
Software design, development, coding and
test.
WP 235.7: Built-In-Test design, development, coding
and test
5.2.3.6 W̲P̲ ̲2̲3̲6̲:̲ ̲D̲a̲t̲a̲ ̲C̲h̲a̲n̲n̲e̲l̲
The design of the existing data channel is used as
the basis for the design of the high speed data channel,
connecting the processing chain with the torage and
I/O Unit.
The activities are
WP 236.1: Re-design, testing and manufacturing of
the Data Channel Adapter (DACA)
WP 236.2: Re-design, testing and manufacturing of
the Data Channel Interface (DCI)
WP 236.3: Re-design, coding and tesing of M & D Software
5.2.3.7 W̲P̲ ̲2̲3̲7̲:̲ ̲T̲e̲s̲t̲ ̲S̲o̲f̲t̲w̲a̲r̲e̲
This work package covers the Software efforts for performing
the phase II Factory and Acceptance Test.
The activities include:
WP 237.1: Design, development, coding and testing
of phase I Factory Test SW.
WP 237.2: Modifications to the phase II Factory Test
Software to achieve the phase II Acceptance
Test Software.…86…1 …02… …02… …02… …02…
5.2.4 W̲P̲ ̲2̲4̲0̲ ̲P̲r̲o̲c̲u̲r̲e̲m̲e̲n̲t̲
This work package covers the effort required for the
procurement of all items at module level and above
of the SDPS System.
The activities are:
W̲P̲ ̲2̲4̲:̲ Specification
An ordering specification is worked out,
based upon the proper Hardware Specification
W̲P̲ ̲2̲4̲2̲:̲ Ordering and follow-up.
Supplier schedule control
W̲P̲ ̲2̲4̲3̲:̲ Incoming inspection and test
The procurement action follows thesame procedure for
as well in-house products as bought-out equipment.
5.2.5 W̲P̲ ̲2̲5̲0̲:̲ ̲S̲y̲s̲t̲e̲m̲ ̲I̲n̲t̲e̲g̲r̲a̲t̲i̲o̲n̲
This work package covers all the effort required for
the integration and verification checkout of all hardware
modules and equipment, and ofall software modules.
The activities comprise:
W̲P̲ ̲2̲5̲1̲: Hardware mechanical integration
W̲P̲ ̲2̲5̲2̲:̲ Hardware electrical subsystem and system
integration testing
W̲P̲ ̲2̲5̲3̲:̲ Software integration
W̲P̲ ̲2̲5̲4̲:̲ Factory test, evaluation and reporting
5.2.6 W̲P̲ ̲2̲6̲0̲:̲ ̲D̲e̲l̲i̲v̲e̲r̲y̲
This work package covers all efforts required for the
transportation and installation of the phase II delivery.
The following activities are foreseen:
P 261: Packing and shipping
WP 262: Installation and verification Checkout
5.2.7 W̲P̲ ̲2̲7̲0̲:̲ ̲A̲c̲c̲e̲p̲t̲a̲n̲c̲e̲ ̲T̲e̲s̲t̲
This work package covers the formal customer acceptance
testing, evaluation and reporting.
5.3 P̲h̲a̲s̲e̲ ̲I̲I̲I̲:̲ ̲I̲m̲p̲l̲e̲m̲e̲n̲t̲a̲t̲i̲o̲n̲ ̲o̲f̲ ̲P̲r̲e̲p̲r̲o̲c̲e̲s̲i̲n̲g̲ ̲S̲y̲s̲t̲e̲m̲
This Preliminary Phase III Project implementation plan
is to be replaced by the one provided from WP 210 during
phase II.
Phase III starts after the phase II review. Working
meetings will be held as needed, and design reviews
will beheld at the following milestones:
D.R.5: Phase III HW design complete
Phase III SW design complete
D.R.6: HW prototypes and SW modules have been tested
individually.
See work breakdown on figure 5-3 overleaf.
5.3.1 W̲P̲ ̲3̲1̲0̲:̲ ̲P̲h̲a̲s̲e̲ ̲I̲I̲I̲ ̲M̲a̲n̲g̲e̲m̲e̲n̲t̲
The activities are as described for WP 210, excluding
the phase III planning.
5.3.2 W̲P̲ ̲3̲2̲0̲:̲ ̲S̲y̲s̲t̲e̲m̲ ̲E̲n̲g̲i̲n̲e̲e̲r̲i̲n̲g̲ ̲
The activities are as described for WP 220.
5.3.3 W̲P̲ ̲3̲3̲0̲:̲ ̲M̲o̲d̲u̲l̲e̲ ̲I̲m̲p̲l̲e̲m̲e̲n̲t̲a̲t̲i̲o̲n̲
This work package covers the efforts required for the
proviion of the remaining modules for the upgrading
of the phase II delivery to a full preprocessing system.
5.3.3.1 W̲P̲ ̲3̲3̲1̲:̲ ̲S̲D̲I̲/̲M̲T̲C̲ ̲m̲f̲g̲.̲ ̲D̲o̲c̲u̲m̲e̲n̲t̲a̲t̲i̲o̲n̲
This work package covers the activities for providing
the Printed Circuit Board (PCB) version ofthe SDI and
Tape Controller, i.e. manufacturing documentation,
including PCB layout and testing.
5.3.3.2 W̲P̲ ̲3̲2̲2̲:̲ ̲F̲l̲o̲a̲t̲i̲n̲g̲ ̲P̲o̲i̲n̲t̲ ̲P̲r̲o̲c̲e̲s̲s̲o̲r̲
The FPP hardware, firmware and software is implemented
according to the corresponding specifications, proided
in phase I.
This work package covers the following activities:
WP 332.1: FPP hardware detailed design, development
and test
WP 332.2: Basic firmware detailed design development
and coding
WP 332.3: HW/FW integration and test
WP 332.4: FPP handler design, development, coding
and test
WP 332.5: HW/FW/SW integration
WP 332.6: M & D software design, development, coding
and test.
WP 332.7: Built-In-Tese design, development, codng
and test.
5.3.3.3 W̲P̲ ̲3̲3̲3̲:̲ ̲S̲p̲a̲t̲i̲a̲l̲ ̲R̲e̲s̲a̲m̲p̲l̲i̲n̲g̲
This work package covers all the software and firmware
efforts required for performing the Spatial Resampling.
The design, development, coding and testing of the
following modules are comprised
WP 333.1: Parameter calculation and formatting
WP 333.2: Resample Driver
WP 333.3: Output Handler
5.3.3.4 W̲P̲ ̲3̲3̲4̲:̲ ̲T̲i̲m̲e̲ ̲R̲e̲s̲a̲m̲p̲l̲i̲n̲g̲
This work package covers the software and firmware
efforts required for performing the Time Resampling.
The design, development, coding and testng of the following
modules are comprised:
WP 334.1: Parameter calculation and formatting
WP 334.2: Resample driver
WP 334.3: Output Handler
5.3.3.5 W̲P̲ ̲3̲3̲5̲:̲ ̲S̲E̲G̲-̲D̲ ̲F̲o̲r̲m̲a̲t̲t̲e̲r̲
This work package covers the effort for the design,
development,coding and test of the DEMUX SEG-D module.
5.3.3.6 W̲P̲ ̲3̲3̲6̲:̲ ̲1̲ ̲M̲W̲ ̲R̲A̲M̲
The design of the existing 128K RAM is used as the
basis for the 1 MW RAM.
The activities of this work package cover the re-design,
test and manufacturing documentation for
